Solder Paste Flux Mechanics XG-30 Tin Cream 16g PCB Solder Paste SMD BGA Repair Tools In Pakistan

Mechanics XG-30 BGA Solder Paste is a high-quality mobile phone repair tool, cell phone repair solder paste is used for high-precision circuit board SMT soldering, BGA welding process, etc. Welding Flux can be easily applied to the board during PCB assembly. The sticky paste temporarily holds components in place.

Specification of Solder Paste Flux Mechanics XG-30 Tin Cream 16g PCB Solder Paste SMD BGA Repair Tools:

• Type: XG-30(16g)
• Material: Plastic + solder paste
• Color: As the picture
• Application: Mobile phone chip repair, computer and digital service industries, high precision circuit board SMT welding, BGA welding process, etc.
• solder paste solder at room temperature melting point 183 ℃ / quick and easy formation of conductive solder
• Product information: Solder paste, 183 ℃, the degree of melting point, easy soldering, easy molding

Feature of Mechanics XG-30 Solder Paste Flux:

1. 100% brand new and high quality
2. Unique recipes, perfect performance, easy to solder, bright and full solder.
3. Good soldering and soldering tool

Package Include:

• 1 x Solder Paste Flux Mechanics XG-30 Tin Cream 16g PCB Solder Paste SMD BGA Repair Tools In Pakistan